Assembling thin silicon chips on a contact lens

ABSTRACT

A contact lens having a thin silicon chip integrated therein is provided along with methods for assembling the silicon chip within the contact lens. In an aspect, a method includes creating a plurality of lens contact pads on a lens substrate and creating a plurality of chip contact pads on a chip. The method further involves applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, aligning the plurality of lens contact pads with the plurality of chip contact pads, bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding, and forming a contact lens with the lens substrate.

TECHNICAL FIELD

This disclosure generally relates to a contact lens having a thinsilicon chip integrated therein and methods for assembling the siliconchip within the contact lens.

BACKGROUND

Silicon chips are generally assembled using flip chip bonding or wirebonding. Flip chip bonding is a method for interconnecting semiconductordevices to external circuitry (e.g., a circuit board or another chip orwafer), with solder bumps that have been deposited onto chip pads. Thesolder bumps are deposited on the chip pads on a top side of the waferduring a final wafer processing step. In order to mount the chip toexternal circuitry it is flipped over so that its top side faces down,and aligned so that its pads align with matching pads on an externalcircuit. The solder bumps are then melted to complete interconnects. Inwire bonding, the chip is mounted to external circuitry in an uprightposition and wires are used to interconnect the chip pads to externalcircuitry. However, these silicon chip assembly methods are not suitablefor assembling silicon chips on or within a contact lens. Furthermore,standard chips are too thick to fit onto a contact lens.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B present alternative perspectives of an example contactlens having a silicon chip integrated therein/thereon in accordance withaspects described herein.

FIGS. 2A-2C present cross-sectional views of example embodiments of acontact lens having a silicon chip integrated therein in accordance withaspects described herein.

FIG. 3A-3C depict a process for creating silicon chips that can beassembled onto a contact lens in accordance with aspects describedherein.

FIG. 4 illustrates a high level overview of processes by which a siliconchip is assembled onto a contact lens substrate in accordance withaspects described herein.

FIGS. 5A-5E illustrate an exemplary process 500 by which a silicon chipis assembled onto a contact lens substrate in accordance with aspectsdescribed herein.

FIGS. 6A-6D illustrate another an alternative perspective of exemplaryprocess 500 by which a silicon chip is assembled onto a contact lenssubstrate in accordance with aspects described herein.

FIGS. 7A-7D illustrate another exemplary process 700 by which a siliconchip is assembled onto a contact lens substrate in accordance withaspects described herein.

FIGS. 8A-8D illustrate another an alternative perspective of exemplaryprocess 800 by which a silicon chip is assembled onto a contact lenssubstrate in accordance with aspects described herein.

FIGS. 9A-9D illustrate another exemplary process 900 by which a siliconchip is assembled onto a contact lens substrate in accordance withaspects described herein.

FIGS. 10A-10D illustrate another an alternative perspective of exemplaryprocess 900 by which a silicon chip is assembled onto a contact lenssubstrate in accordance with aspects described herein.

FIGS. 11A-11C illustrate a process for employing a contact lenssubstrate having a silicon chip bonded thereon to form a contact lens inaccordance with aspects described herein.

FIG. 12A presents an alternative, three-dimensional view of a contactlens form in accordance with aspects described herein.

FIG. 12B depicts the final processing of a contact lens form to form acontact lens in accordance with aspects described herein.

FIG. 13 presents a exemplary methodology by which a silicon chip isassembled onto and/or within a contact lens in accordance with aspectsdescribed herein.

FIG. 14 presents another exemplary methodology by which a silicon chipis assembled onto and/or within a contact lens in accordance withaspects described herein.

FIG. 15 presents another exemplary methodology by which a silicon chipis assembled onto and/or within a contact lens in accordance withaspects described herein.

DETAILED DESCRIPTION

Various aspects are now described with reference to the drawings,wherein like reference numerals are used to refer to like elementsthroughout. In the following description, for purposes of explanation,numerous specific details are set forth in order to provide a morethorough understanding of one or more aspects. It is evident, however,that such aspects can be practiced without these specific details. Inother instances, structures and devices are shown in block diagram formin order to facilitate describing one or more aspects.

In one or more aspects, the disclosed subject matter relates to methodsfor manufacturing a contact lens having an integrated circuit integratedtherein or thereon. In an aspect, the method involves creating aplurality of lens contact pads on a lens substrate and creating aplurality of chip contact pads on an integrated circuit element or chip,such as a silicon chip. Assembly bonding material is then applied to theplurality of lens contact pads or the plurality of chip contact pads.The chip is then bonded to the lens substrate via the assembly bondingmaterial whereby the lens contact pads are aligned with the chip contactpads.

After the chip is bonded to the lens substrate, the lens substrate isformed into a contact lens. In an aspect, prior to forming the lenssubstrate into a contact lens, the chip is sealed onto the lenssubstrate. The lens substrate is then cut into a ring shape and moldedto match curvature of an eye over which the contact lens is to be worn.The molded lens substrate is then embedded into a hydrogel to form thecontact lens.

In some aspects, the plurality of chip contact pads are formed as metallines on the chip using photolithography. Similarly, the plurality oflens contact pads can be formed as metal lines on the lens substrateusing photolithography. Yet in other aspects, the plurality of lenscontact pads are formed as a plurality of metal squares having a lengthof about 100 microns or less.

The subject methods enable assembly of thin silicon chips within acontact lens without use of bumped pads and standard chips. In someembodiments, the disclosed methods involve thinning a silicon shipsubstrate down to a thickness of less than about 100 microns (e.g.,within the range of 20-100 microns thick) and then dicing the thinnedsubstrate into chips smaller than 1 mm on each side. It is to beappreciated that these noted ranges/sizes are merely exemplary, and anysuitable thickness or size can be employed in accordance withembodiments described herein. Metal lines are patterned onto a chipand/or a lens substrate to create contact pads for the chip and/or thelens substrate. The metal lines also serve as wires to connect otherchips and/or other electrical components of the contact lens (e.g.antennas, sensors, light illuminating diodes (LEDS), and etc.).

In various embodiments, in order to assemble a chip to the lenssubstrate, a small amount of low temperature assembly bonding materialis placed onto contact pads of either the lens substrate or the chipusing a syringe. The contact pads of the chip are then aligned with thecontact pads of the lens substrate and the chip is bonded to the lenssubstrate using the solder material. For example, the lens substrate caninclude multiple contact pads that can be segmented into multipleassembly sites for assembling a chip thereto. Once respective contactpads of a particular assembly site on the lens substrate are coveredwith solder material, the contact pads of the chip are aligned with thelens substrate contact pads in the assembly site and the chip is bondedto the assembly site using a flip-chip bonder. The flip-chip bonder toolaligns the chip contact pads with the lens substrate contact pads andapplies pressure along with temperature to create a mechanical andelectrical connection between the chip and the lens substrate.

After the chip is bonded to the lens substrate, the chip can be sealedonto the lens substrate with a substance (e.g. parylene) to make thelens substrate biocompatible and to hold the chip in place. The lenssubstrate can then be formed into a contact lens. For example, in anaspect, the lens substrate is cut into a ring shape. The ring shape caninclude indentations on the inner and/or outer edges of the ring tofacilitate molding of the ring and to reduce wrinkling. The ring is thenmolded to match curvature of the eye. The ring is further embedded intohydrogel to complete the contact lens assembly process.

FIGS. 1A and 1B depict various perspectives of an example contact lens100 having an integrated circuit or chip 102 integrated therein/thereon.As used herein, the terms integrated circuit and chip are usedinterchangeably. FIG. 1A illustrates a three dimensional image ofexample contact lens 100, and FIG. 1B presents a cross-sectional view ofexample contact lens 100 being worn over an eye 104. Contact lens 100,and additional contact lenses disclosed herein are generally provided ina spherical shape that conforms to shape of an eye.

With reference to FIG. 1B, contact lens 100 includes two primarysurfaces, an inner surface 108 and an outer surface 106, both of whichare spherical. The inner surface 108 is concave and is adjacent to/restson, a surface of the eye 104. The outer surface 106 is convex andopposite the inner surface 108. The contact lens 100 has a thicknessthat spans in a horizontal direction between inner surface 106 and outersurface 104. Chip 102 is located within a thickness of the contact lens102. In general aspects, as illustrated in FIG. 1B the width of the lensis thickest (relative to the width of the lens at other areas of thelens) at a center point of the lens, tapering outwardly to a knifelikeedge at the perimeter of the lens. The particular dimensions (includingdimensions attributable to thickness, diameter, curvature, and etc.) ofthe subject contact lenses are not critical and may vary.

As generally described herein, chip 102 is silicon chip that can beemployed by contact lens 100 to facilitate electrical operations of thecontact lens. In particular, chip 102 can perform various computing andlogic functions of contact lens 102. Further, although not shorn in thefigures, it is to be appreciated that contact lenses disclosed hereincan include multiple electrical components that connect to silicon chip102. For example, contact lenses disclosed herein can include sensors,antennas, LEDs, power sources, and etc. In addition, although contactlens 100 (and additional contact lenses described herein) is depictedhaving a single silicon chip 102, it should be appreciated than contactlens 100 (and additional contact lenses described herein) can beprovided having a plurality of chips 102 integrated therein.

In an embodiment, silicon chip 102 is a piece of almost pure siliconhaving a size smaller than standard silicon chips employed in standardcomputing devices. For example, while most computing devices employsilicon chips that are one square centimeter and have a thickness ofabout 1 millimeter, chip 102 can have a size of about 1 squaremillimeter and a thickness less than 100 microns. In an aspect, siliconchip 102 contains a plurality (up to millions) of transistors and othersmall electronic circuit components, packed and interconnected in layersbeneath the surface of the chip. The surface of the silicon chip canfurther include a grid of metallic lines etched thereon which are usedto make electrical connections to other components of the chip 102and/or the contact lens 100

FIGS. 2A-2C present cross-sectional views of example embodiments of acontact lens having silicon chip 206 integrated therein in accordancewith aspects described herein. The contact lenses depicted in FIGS. 2A,2B, and 2C, lenses 200, 202, and 204 respectively, respectively have twoor more layers where silicon chip 206 is integrated within one of thelayers. The lenses 200, 202, and 204 are formed by first integratingsilicon chip 206 into a lens substrate layer 214 and then forming one ormore additional contact lens layers 216 on and/or around the lenssubstrate layer 214. In particular, as described in detail infra, chip206 is first assembled onto a lens substrate 214. In an aspect, the lenssubstrate is then molded into a lens shape to fit the contours of theeye 208 and combined within a contact lens material (e.g. hydrogel) toform the contact lens.

The lens substrate layer 214 having the silicon chip 206 and the contactlens material layer 216 can be combined in a variety of manners. In anaspect, in order to combine the lens substrate layer 214 and the contactlens material layer 216, the lens substrate can be dipped into liquidcontact lens material 216. In another aspect, in order to combine thelens substrate layer 214 and the contact lens material layer 216, thelens substrate 214 can be coated/covered with lens contact material 216on one or both sides of the lens substrate. Still in other aspects, inorder to combine the lens substrate layer 214 and the contact lensmaterial layer 216, the lens substrate 214 can be pressed into and/orbonded with one or more layers of lens contact material 216.

The lens substrate layer 214 and the lens material layer(s) 216 caninclude various materials. In an aspect, the lens substrate layer 214and the lens material layer 216 comprise the same material. In anotheraspect, the lens substrate layer 214 and the lens material layercomprise different materials. The lens substrate layer 214 can includeany suitable material that enables fixation of contact pads to thematerial (e.g. metal pads and/or metal lines) and fixation of a chip 206to the contact pads.

Some exemplary material that can be employed as the lens substrate layermaterial 214 include but are not limited to a soft polymer materialincluding but not limited to, a hydrogel, a silicone based hydrogel, apolyacrlyamide, or a hydrophilic polymer. For example, in an aspect,contact lens substrate layer 214 is formed from a substrate materialthat includes at least one of a crosslinked hydrogel comprisinghydrophilic monomers (e.g. N-Vinylpyrrolidone,1-Ethenyl-2-pyrrolidone,N,N-dimethylacrylamide, 2-hydroxyethylmethacrylate, hydroxyethyl acrylate, methacrylic acid and acrylic acid),a strengthening agent, a ultraviolent light (UV) blocker, or a tint.

In another aspect, contact lens substrate layer 214 is formed from asubstrate material that includes at least of a one silicone hydrogel(e.g. crosslinked hydrogels containing silicone macromers and monomers,as well as hydrophilic monomers that absorb water). In yet anotheraspect, contact lens substrate layer 214 is formed from a substratematerial that includes one or more rigid materials including but notlimited to, a silicone polymer, polymethyl methacrylate, or rigid gaspermeable materials.

The lens material layer 216 can include any suitable material thatprovides support for the lens substrate layer 214, contain/embed thelens substrate layer 214 and/or otherwise form a structural and/orfunctional body of the contact lens. Some exemplary materials that canbe employed as the lens material layer 216 can include but are notlimited to a soft polymer material including but not limited to, ahydrogel, a silicone based hydrogel, a polyacrlyamide, or a hydrophilicpolymer. For example, in an aspect, lens material layer 216 is formedfrom a substrate material that includes at least one of a crosslinkedhydrogel comprising hydrophilic monomers (e.g. N-Vinylpyrrolidone,1-Ethenyl-2-pyrrolidone,N,N-dimethylacrylamide, 2-hydroxyethylmethacrylate, hydroxyethyl acrylate, methacrylic acid and acrylic acid),a strengthening agent, a ultraviolent light (UV) blocker, or a tint. Inanother aspect, lens material layer 216 is formed from a substratematerial that includes at least of a one silicone hydrogel (e.g.crosslinked hydrogels containing silicone macromers and monomers, aswell as hydrophilic monomers that absorb water). In yet another aspect,lens material layer 216 is formed from a substrate material thatincludes one or more rigid materials including but not limited to, asilicone polymer, polymethyl methacrylate, or rigid gas permeablematerials.

As illustrated in FIG. 2A, in an aspect, the lens substrate layer 214 islocated at an outer surface 210 of the contact lens 200 and the lensmaterial layer 216 is located at an inner surface 212 of the contactlens 200. According to this aspect, contact lens 200 can include twolayers, lens substrate layer 214 and a lens material layer 216. The lenssubstrate layer 214 includes the silicon chip and the silicon chip canfurther be located at/on the outer surface 210 of the contact lens. Inan example, in order to form contact lens 200, silicon chip 206 is firstintegrated onto lens substrate layer 214 and then the lens substratelayer 214 is coated on its concave side with contact lens material 216.

As shown in FIG. 2B, in another aspect, the lens substrate layer 214 islocated at an inner surface 212 of contact lens 202 and the lensmaterial layer 216 is located at an outer surface 210 of the contactlens 202. According to this aspect, contact lens 202 can also includetwo layers, lens substrate layer 214 and a lens material layer 216. Thelens substrate layer 214 includes the silicon chip 206 and the siliconchip can further be located at/on the inner surface 212 of the contactlens 202. In an example, in order to form contact lens 202, silicon chip206 is first integrated onto lens substrate layer 214 and then the lenssubstrate layer 214 is coated on its convex side with contact lensmaterial 216.

As seen in FIG. 2C, in yet another aspect, contact lens 204 includes alens substrate layer 214 located between two layers of lens material216. According to this aspect, contact lens 204 can also include threelayers. The lens substrate layer 214 includes the silicon chip 206 andthus the silicon chip is located suspended between the inner surface 212and the outer surface 210 of the contact lens 204. In an example, inorder to form contact lens 204, silicon chip 206 is first integratedonto lens substrate layer 214 and then the lens substrate layer 214 isdipped into or otherwise entirely coated/embedded within, contact lensmaterial 216.

With reference now to FIG. 3, illustrated is a process 300 for creatingsilicon chips that can be assembled onto a contact lens in accordancewith aspects described herein. A silicon chip substrate 301 is firstthinned down to a thickness of less than 100 microns. In an aspect, thesilicon chip substrate 300 is thinned down to a thickness of less than75 microns. In another aspect, the silicon chip substrate 300 is thinneddown to a thickness of less than 50 microns. Still, in yet anotheraspect, the silicon chip substrate 300 is thinned down to a thickness ofless than 35 microns. The thinned silicon chip substrate 302 is thendiced into a plurality of silicon chips 304 having a size suitable forintegration into a contact lens. In particular, the size and shape ofthe chip 304 is restricted by thickness and curvature of a contact lensin which it is to be integrated. A chip 304 can have a rectangular shapeor a square shape. In an aspect, a chip 304 can have sides less than 15mm. In another aspect, a chip 304 can have sides less than 10 mm. Inanother aspect, a chip 304 can have sides less than 5.0 mm. Still in yetanother aspect, a chip 304 can have sides less than 1.0 mm.

FIGS. 4-10D illustrate exemplary embodiments of processes by which achip 304 is assembled onto a contact lens substrate 418 in accordancewith aspects described herein. FIG. 4 illustrates a high level overviewof processes by which a chip 304 is assembled onto a contact lenssubstrate 418 while FIGS. 5A-10D illustrate detailed steps in variousprocesses by which a chip 304 is assembled onto a contact lens substrate418. After one or more chips have been assembled onto contact lenssubstrate 418, the contact lens substrate can be modified into a contactlens. In particular, the contact lens substrate 418 can be molded intothe shape of a contact lens to become the contact lens substrate layer(e.g. layer 214) in an assembled contact lens (e.g. lenses 200, 202, 204and the like). In various aspects, the contact lens substrate 418 caninclude one or more of the structure and/or functionality of contactlens substrate layer 214 (and vice versa). In particular, it should beappreciated that contact lens substrate 418 can comprise the materialsdescribed with reference to contact lens substrate layer 214.

Turning initially to FIG. 4, a silicon chip 304 that has been sized to asuitable size for integration into a contact lens (e.g. having athickness less than 100 microns and sides less than about 1 mm) isdepicted having metal lines 402 provided thereon. In particular, after asilicon chip 304 is created via process 300, prior to integration onto acontact lens substrate 418, the silicon chip 304 can be processed toform various functional features of the silicon chip, including at leastchip contact pads. Chip contact pads provide the contact point forelectrically connecting a chip 304 to substrate 418 and/or otherelectrical component. In an aspect, traditional metal chip contact pads(not depicted) can be created on a surface of chip 304. For example,metal chip pads in the form of small and thin sheets of metal in theshape of squares or rectangles can be formed on a surface of the chip304 to create the chip contact pads. Such metal contact pads can havesides less than 100 microns.

However, in another aspect, as depicted in FIG. 4, metals lines 402 arepatterned onto a surface of chip 304. For example, metal lines 402 canbe patterned onto a surface 406 of a chip 304 using photolithography.These metal lines 402 serve as chip contact pads for the chip 304 andalso serve as wires to connect the chip 304 to other chips and/orcomponents of a contact lens (e.g. antennas, sensors, LEDs, and etc.) inwhich the chip 304 is integrated. For example, intersection points 404of metal lines 402 can serve as the chip contact pads of chip 304.However, it should be appreciated that any point of a metal line 402 canserve as a chip contact pad. In addition, although intersecting parallelmetal lines 402 are shown forming a grid pattern on chip 304, such aline configuration is merely depicted for exemplary purposes. Inparticular, lines 402 can be formed in any pattern, in includes patternshaving non-intersecting lines and patterns having non-parallel lines.

In an aspect, the surface of chip 304 on which the metal lines areformed, surface 406, is a substantially flat polymer layer provided onthe chip 304. According to this aspect, the metal lines 402 arepatterned onto the substantially flat polymer layer usingphotolithography. For example, the polymer layer can include but is notlimited to parylene, polyimide, and polyethylene terephthalate (PET).

Contact lens substrate 418 is also presented having lens contact padslocated on a surface thereof. In an aspect, lens contact pads providethe contact points for electrically and/or physically connecting thesubstrate 418 with the chip 304 and/or electrically connecting otherelectrical components provided within a contact lens in which the lenssubstrate 418 is integrated, to the chip 304. In an aspect, traditionalmetal chip contact pads 414 can be created on a surface of lenssubstrate 418. For example, metal chip pads in the form of small andthin sheets of metal in the shape of squares or rectangles can be formedon a surface of the lens substrate 418 to create the lens contact pads.Such metal contact pads can have sides less than 100 microns.

However, in another aspect, metals lines 416 are patterned onto asurface of contact lens substrate 418 in a same or similar fashion asmetal lines 402 patterned on chip 304. For example, metal lines 416 canbe patterned onto a surface of lens substrate 418 usingphotolithography. As with metal lines 402, metal lines 416 can serve aslens contact pads for the lens substrate 418 and also serve as wires toconnect the chip 304 to other chips and/or components of a contact lens(e.g. antennas, sensors, LEDs, and etc.) in which the chip 304 isintegrated. In addition, although intersecting parallel metal lines 416are shown forming a grid pattern on substrate 418 such a lineconfiguration is merely depicted for exemplary purposes. In particular,lines 416 can be formed in any pattern, in includes patterns havingnon-intersecting lines and patterns having non-parallel lines.

In an aspect, the lens substrate and/or a surface of lens substrate 418on which the metal lines 416 are formed is a substantially flat polymerlayer. According to this aspect, the metal lines 416 are patterned ontothe substantially flat polymer layer using photolithography. Forexample, the polymer layer can include but is not limited to parylene,polyimide, and polyethylene terephthalate (PET).

It should be appreciated that both traditional metal contact pads 414and metal line contact pads 416 are provided on lens substrate 418merely for exemplary purposes. Further, although only a partial area ofthe lens substrate 418 is presented having contact pads thereon, itshould be appreciated that any portion of the substrate 418 can beprovided with contact pads. For example, the entire surface of thesubstrate 418 can be patterned with metal lines or square metal pads.According to this example, a subset of the metal lines/metal pads can beselectively employed as the contact pads for assembly of a chip thereon.In other words, a subset of the metal lines/metal pads can beselectively employed as an assembly site for assembly of a chip thereonand the substrate can be provided with a plurality of potential assemblysites. As used herein, the term assembly site refers to an area ofsubstrate 418 having lens contact pads that can be aligned with thecontact pads of a chip.

In order to attach silicon chip 304 to contact lens substrate 418, anassembly bonding material (not shown) is applied to either the chip orthe lens substrate 418. In an aspect, the assembly bonding materialincludes an anisotropic conductive film (ACF) or an anisotropicconductive paste (ACP). ACF and ACP are materials that establish aconducting path when pressed between two metal pads, such as a lenscontact pad and a chip contact pad. According to this aspect, an ACF orACP is applied over an entire assembly site on the substrate 418 (and/orthe chip) having lens (or chip) contact pads therein so as to cover thecontact pads and the area between and around the contact pads. With thisaspect, assembly bonding material does not need to be applied to thecontact pads individually.

After application of the ACF or ACP, the silicon chip 304 is thenflipped over, following arrow 408, so that the surface 406 of thesilicon chip 304 having the chip contact pads (e.g. the surface havingthe metal lines 402) faces a surface of the contact lens substrate 418having the lens contact pads thereon. Dashed lines 402 presented onflipped chip 304 are indicative of the metal lines 402 now on theunderside 306 of the chip. The chip 304 is then lowered onto thesubstrate 418 and the chip contact pads are aligned with the lenscontact pads. The chip 304 is then assembled onto the lens substrate viapressing the chip 304 onto the ACF or ACP and heating the chip304/substrate 418 assembly to cure or solidify the chip 304 connectionwith the substrate 418. In particular, the ACP or ACF is activated inorder to secure chip 304 to substrate 418 in part by the heating. Forexample, activation of an ACP or ACF can include boiling a flux out ofthe ACP or ACF to create a conductive path between the chip contact padsand lens contact pads and to create an adhesive (e.g. an underfill)material that bonds chip 304 to substrate 418. In an aspect, heating ofthe of the chip 304/substrate 418 assembly is performed so thatconduction results in a single direction so that the contact pads do notshort.

In another aspect, the assembly bonding material includes a soldersolution or solder paste. According to this aspect, solder solution orsolder paste (not shown) is applied to either the chip contact pads orthe lens contact pads in a particular assembly site. In an aspect, thesolder solution/paste is applied to respective ones of either the chipcontact pads or the lens contact pads using a syringe. The silicon chip304 is then flipped over, following arrow 408, so that the surface 406of the silicon chip 304 having the chip contact pads (e.g. the surfacehaving the metal lines 402) faces a surface of the contact lenssubstrate 418 having the lens contact pads thereon. Dashed lines 402presented on flipped chip 304 are indicative of the metal lines 402 nowon the underside 306 of the chip. The chip 304 is then lowered onto thesubstrate 418 and the chip contact pads are aligned with the lenscontact pads. Head and pressure are then applied to at least one of thechip 304 or the lens substrate 418 so that the solder solution is flowedand solidified so as to bond the chip 304 to the lens substrate 418.Arrow 410 shows an example where the chip 304 is bonded to an assemblysite on the substrate 418 that comprises metal squares as contact pads.Arrow 412 shows an example where the chip 304 is bonded to an assemblysite on the substrate 418 that comprises metal lines as contact pads.

In some aspects, an underfill is applied to the lens substrate/chipcomplex in order to hold the chip 304 onto the substrate 418. Inparticular, connections established between the chip 304 and thesubstrate 418 can be relatively weak when using a solder solution/pasteas the assembly bonding material. Accordingly, an underfill material canbe applied between the chip 304 and the substrate so as to flow aroundthe respective solder pads and solidified solder material to furtherfacilitate bonding of the chip 304 to the substrate. The underfill caninclude a non-conductive or substantially non-conductive material suchas an epoxy or adhesive.

In an aspect, flipping 408, alignment of chip 304 with contact pads onlens substrate 418, and bonding is performed using a flip chip bonder.As used herein, the term flip chip bonder refers to a tool that performsfunctions and features of traditional flip chip bonding methods,including at least flipping of chip 304, alignment of chip 304 withsubstrate 418, and application of heat and pressure to chip 304 andsubstrate 418 such that the chip 304 and the substrate 418 bond via thesolder solution provided there between.

In an aspect, the assembly bonding material that is applied to the lenssubstrate or chip is a low activation temperature material. For example,in some aspects, the assembly bonding material includes an ACF or an ACPthat has a low activation temperature, such as below 200° C. In otheraspects, the assembly bonding material includes a solder material thathas a low melting point, such as below 200° C. In another aspect, theassembly bonding material can have an activation temperature or boilingpoint less than 150° C. In another aspect, the assembly bonding materialcan have an activation temperature or boiling point less than 100° C. Inyet another aspect, the assembly bonding material can have an activationtemperature or boiling point less less than 85° C. Still in yet anotheraspect, the assembly bonding material can have an activation temperatureor boiling point less than 65° C.

Some exemplary low temperature solder solutions/pastes that can beemployed as the assembly bonding material can include but are notlimited to solutions or pastes having varying ratios of indium, tin,and/or bismuth. For example, indium alloy number 19 from Indium Corp.can be employed as an exemplary solder solution and has a ration of 51%In, 32.5% Bi, and 16.5 Sn with a melting temperature of about 60° C. Inan aspect, an employed solder solution/paste is lead-free so as not todisrupt an eye in which a contact lens, having a chip 304 integratedtherein, is worn. In some aspects, the solder solution can also be mixedwith a flux or acidic solution (such as HCL and water) to prevent orreduce oxidation of the solder solution. Some exemplary fluxes caninclude but are not limited to TACFlux® 020B and Indalloy Flux #4-OAfrom Indium Corp. Additionally, a commercially available solder solutioncan be employed as the assembly bonding material that is formed as apaste suspended in a solder solution, such NC-SMQ®90 Solder Paste fromIndium Corp.

Looking now to FIGS. 5A-5E, illustrated is an exemplary process 500 bywhich a silicon chip is assembled onto a contact lens substrate 418 inaccordance with aspects described herein. In FIGS. 5A-5E, it should beappreciated that only a portion of contact lens substrate 418 ispresented for exemplary purposes. Process 500 follows in part, arrow 410of FIG. 4. In particular, process 500 present an embodiment where chip304 is bonded to an assembly site on the substrate 418 that comprisesmetal squares 414 as contact pads.

As seen in FIG. 5A, a contact lens substrate 418 is provided having aplurality of metal square contact pads 414 created thereon. A chip 304is assembled to substrate 418 using either solder solution according toFIG. 5B or a solder film or paste including ACF or ACP respectivelyaccording to FIG. 5C. Accordingly, process 500 can proceed with stepsaccording to FIG. 5B or according to FIG. 5C.

In FIG. 5B, solder solution 502 is applied to each of the lens contactpads 414. (The solder solution 502 is represented by the darkening ofthe lens contact pads 414 as compared to the lens contact pads 414 ofFIG. 5A). In an aspect, the solder solution 502 is selectively appliedto each of the lens contact pads 414 using a syringe, pipette, needle,or other precise applicator tool. Then a chip 304 having chip contactpads in the form of metal lines 402 is flipped over and aligned withlens substrate 418. In particular, the chip contact pads, (such as theintersection points of the metal lines 402), are aligned with each ofthe lens contact pads 414 having solder solution 502 thereon.

In FIG. 5C, (the alternative to FIG. 5B), an ACF or ACP 506 is appliedto the lens substrate 418 so as to cover the lens contact pads 414 andthe area around the respective lens contact pads 414 in the assemblysite. Then a chip 304 having chip contact pads in the form of metallines 402 is flipped over and aligned with lens substrate 418. Inparticular, the chip contact pads, (such as the intersection points ofthe metal lines 402), are aligned with each of the lens contact pads 414having an ACF or ACP thereon.

In FIG. 5D, the chip 304 is lowered onto the lens substrate 418 and thechip is bonded to the lens substrate via the solder solution or theACF/ACP in response to the application of pressure and/or heat. Forexample, a flip chip bonder can perform the flipping, aligning andbonding aspects of method 500. In an aspect, heat is applied at atemperature less than 200° C. to substantially only the area of thesubstrate 418 where the chip 304 is being assembled (e.g. the assemblysites) so as to cause no or limited damage to the remaining area of thesubstrate. In FIG. 5E, once the solder solution or ACF/ACP has beensolidified, hardened and/or cured, in an aspect, the chip 304 can besealed onto the lens substrate 418 using a sealant 504. The sealant 504can cover and/or otherwise coat the chip 304 to hold the chip 304 inplace on the lens substrate 418 and/or to make the lens substrate/chipcomplex biocompatible. In an aspect, (not shown), the entiresubstrate/chip complex can be coated in a sealant 504. For example, theentire substrate/chip complex can be dipped or rinsed with a sealant504. In an aspect, the sealant 504 is parylene or polyimide.

FIGS. 6A-6D, illustrate an alternative perspective of exemplary process500 by which a silicon chip is assembled onto a contact lens substrate418 in accordance with aspects described herein. In particular, FIGS.6A-6D present cross-sectional views of chip 304 and lens 418 duringprocess 500.

As seen in FIG. 6A, a contact lens substrate 418 is provided having aplurality of metal square contact pads 414 created thereon. In FIG. 5B,solder solution 502 is applied to each of the lens contact pads 414. Inan aspect, the solder solution 502 is selectively applied to each of thelens contact pads 414 using a syringe, pipette, needle, or other preciseapplicator tool. Then a chip 304 having chip contact pads 402 is alignedwith lens substrate 418. In particular, the chip contact pads 402 arealigned with each of the lens contact pads 414 having solder solution502 thereon. In an aspect, the chip contact pads 402 are theintersection points 404 of the metal lines 402 as presented on chip 304in FIG. 4.

In FIG. 6C, the chip 304 is lowered onto the lens substrate 418 and thechip is bonded to the lens substrate via the solder solution in responseto the application of pressure and/or heat. In an aspect, heat isapplied at a temperature less than 200° C. to substantially only thearea of the substrate 418 where the chip 304 is being assembled (e.g.the assembly sites) so as to cause limited damage to the remaining areaof the substrate. For example, a flip chip bonder can perform theflipping, aligning and bonding aspects of method 500. In an aspect, anunderfill material (not shown) can be applied between the lens substrate418 and the chip 304 so as to fill in gaps between the solidified soldermaterial and further adhere the chip 304 to the substrate 418. In FIG.6D, once the solder solution has been solidified, hardened and/or cured,in an aspect, the chip 304 can be sealed onto the lens substrate 418using a sealant 504. The sealant 504 can cover and/or otherwise coat thechip 304 to hold the chip 304 in place on the lens substrate 418 and/orto make the lens substrate/chip complex biocompatible. In an aspect,(not shown), the entire substrate/chip complex can be coated in asealant 504. For example, the entire substrate/chip complex can bedipped or rinsed with a sealant 504.

Looking now to FIGS. 7A-7D, illustrated is another exemplary process 700by which a silicon chip is assembled onto a contact lens substrate 418in accordance with aspects described herein. In FIGS. 7A-7D, it shouldbe appreciated that only a portion of contact lens substrate 418 ispresented for exemplary purposes. Process 700 follows in part, arrow 412of FIG. 4. In particular, process 700 present an embodiment where chip304 is bonded to an assembly site on the substrate 418 that comprisesmetal lines 416 as contact pads.

As seen in FIG. 7A, a contact lens substrate 418 is provided having aplurality of metal lines 416 created thereon. The metal lines 416 serveas the lens contact pads. In an aspect, the intersection point of themetal lines in particular serve as the lens contact pads. According tothis aspect, solder solution 502 is applied to the lens contact pads 416at each metal line intersection point. In an aspect, the solder solution502 is selectively applied to each of the lens contact pads 416 using asyringe, pipette, needle, or other precise applicator tool. In FIG. 7B,a chip 304 having chip contact pads in the form of metal lines 402 isflipped over and aligned with lens substrate 418. In particular, thechip contact pads, (such as the intersection points of the metal lines402), are aligned with each of the lens contact pads 416, the metal line416 intersection points, having solder solution 502 thereon.

In FIG. 7C, the chip 304 is lowered onto the lens substrate 418 and thechip is bonded to the lens substrate via the solder solution in responseto the application of pressure and/or heat. In an aspect, heat isapplied at a temperature less than 200° C. to substantially only thearea of the substrate 418 where the chip 304 is being assembled (e.g.the assembly sites) so as to cause no or limited damage to the remainingarea of the substrate. For example, a flip chip bonder can perform theflipping, aligning and bonding aspects of method 700. In an aspect, anunderfill material (not shown) can be applied between the lens substrate418 and the chip 304 so as to fill in gaps between the solidified soldermaterial and further adhere the chip 304 to the substrate 418. In FIG.7D, once the solder solution has been solidified, hardened and/or cured,in an aspect, the chip 304 can be sealed onto the lens substrate 418using a sealant 504. The sealant 504 can cover and/or otherwise coat thechip 304 to hold the chip 304 in place on the lens substrate 418 and/orto make the lens substrate/chip complex biocompatible. In an aspect,(not shown), the entire substrate/chip complex can be coated in asealant 504. For example, the entire substrate/chip complex can bedipped or rinsed with a sealant 504.

FIGS. 8A-8D, illustrate an alternative perspective of exemplary process700 by which a silicon chip is assembled onto a contact lens substrate418 in accordance with aspects described herein. In particular, FIGS.8A-8D present cross-sectional views of chip 304 and lens 418 duringprocess 700.

As seen in FIG. 8A, a contact lens substrate 418 is provided having aplurality of contact pads 416 created thereon. The contact pads 416 areformed from metal lines such as metal lines 416 that have been patternedonto the lens substrate 418 via photolithography. In an aspect, thecontact pads 416 include intersection points of metal lines 416 asdepicted in FIG. 4. The contact pads 416 further have solder solution502 applied thereto. In an aspect, the solder solution 502 isselectively applied to each of the lens contact pads 416 using asyringe, pipette, needle, or other precise applicator tool. In FIG. 8A,a chip 304 having chip contact pads 402 is aligned with lens substrate418. In particular, the chip contact pads 402 are aligned with each ofthe lens contact pads 416 having solder solution 502 thereon. In anaspect, the chip contact pads 402 are similarly intersection points 404of the metal lines 402 as presented on chip 304 in FIG. 4.

In FIG. 8C, the chip 304 is lowered onto the lens substrate 418 and thechip is bonded to the lens substrate via the solder solution in responseto the application of pressure and/or heat. In an aspect, heat isapplied at a temperature less than 200° C. to substantially only thearea of the substrate 418 where the chip 304 is being assembled (e.g.the assembly sites) so as to cause no or limited damage to the remainingarea of the substrate. For example, a flip chip bonder can perform theflipping, aligning and bonding aspects of method 700. In an aspect, anunderfill material (not shown) can be applied between the lens substrate418 and the chip 304 so as to fill in gaps between the solidified soldermaterial and further adhere the chip 304 to the substrate 418. In FIG.8D, once the solder solution has been solidified, hardened and/or cured,in an aspect, the chip 304 can be sealed onto the lens substrate 418using a sealant 504. The sealant 504 can cover and/or otherwise coat thechip 304 to hold the chip 304 in place on the lens substrate 418 and/orto make the lens substrate/chip complex biocompatible. In an aspect,(not shown), the entire substrate/chip complex can be coated in asealant 504. For example, the entire substrate/chip complex can bedipped or rinsed with a sealant 504.

Looking now to FIGS. 9A-9D, illustrated is another exemplary process 900by which a silicon chip is assembled onto a contact lens substrate 418in accordance with aspects described herein. In FIGS. 9A-9B, it shouldbe appreciated that only a portion of contact lens substrate 418 ispresented for exemplary purposes. Process 900 presents an embodimentwhere chip 304 is bonded to an assembly site on the substrate 418 thatcomprises metal square 414 as contact pads and where the bondingsolution is applied to the chip contact pads.

As seen in FIG. 9A, a silicon chip 304 is provided having a plurality ofmetal lines 402 created thereon. The metal lines 402 serve as the chipcontact pads. In an aspect, the intersection points of the metal linesin particular serve as the chip contact pads. According to this aspect,solder solution 502 is applied to the chip contact pads 402 at eachmetal line intersection point. In an aspect, the solder solution 502 isselectively applied to each of the chip contact pads 402 using asyringe, pipette, needle, or other precise applicator tool. The chip is304 is further flipped over following arrow 408 so that the chip contactpads having the solder solution applied thereto can face a surface ofthe lens substrate 418 having contact pads 414 thereon. The dashed lineson flipped chip 304 are indicative of the chip contact pads now on theunderside 406 of the chip.

In FIG. 9B, the flipped chip 304 having the chip contact pads withsolder applied is aligned with lens substrate 418. In particular, thechip contact pads, (such as the intersection points of the metal lines402), are aligned with each of the lens contact pads 414. Lens substrate418 is provided having contact pads 414 located thereon. Although lenscontact pads 414 are presented as metal squares, it should beappreciated that the lens contact pads can be in the form of metallines.

In FIG. 9C, the chip 304 is lowered onto the lens substrate 418 and thechip is bonded to the lens substrate via the solder solution in responseto the application of pressure and/or heat. In an aspect, heat isapplied at a temperature less than 200° C. to substantially only thearea of the substrate 418 where the chip 304 is being assembled (e.g.the assembly sites) so as to cause no or limited damage to the remainingarea of the substrate. For example, a flip chip bonder can perform theflipping, aligning and bonding aspects of method 900. In an aspect, anunderfill material (not shown) can be applied between the lens substrate418 and the chip 304 so as to fill in gaps between the solidified soldermaterial and further adhere the chip 304 to the substrate 418. In FIG.9D, once the solder solution has been solidified, hardened and/or cured,in an aspect, the chip 304 can be sealed onto the lens substrate 418using a sealant 504. The sealant 504 can cover and/or otherwise coat thechip 304 to hold the chip 304 in place on the lens substrate 418 and/orto make the lens substrate/chip complex biocompatible. In an aspect,(not shown), the entire substrate/chip complex can be coated in asealant 504. For example, the entire substrate/chip complex can bedipped or rinsed with a sealant 504.

FIGS. 10A-10D, illustrate an alternative perspective of exemplaryprocess 900 by which a silicon chip is assembled onto a contact lenssubstrate 418 in accordance with aspects described herein. Inparticular, FIGS. 10A-10D present cross-sectional views of chip 304 andlens 418 during process 900.

As seen in FIG. 10A, a silicon chip 304 is provided having a pluralityof metal lines 402 created thereon. The metal lines 402 serve as thechip contact pads. In an aspect, the contact pads 402 are theintersection points of the metal lines 402 (point 404) as presented inFIG. 4. According to this aspect, solder solution 502 is applied to thechip contact pads 402 at each metal line intersection point. In anaspect, the solder solution 502 is selectively applied to each of thechip contact pads 402 using a syringe, pipette, needle, or other preciseapplicator tool. The chip is 304 is further flipped over following arrow408 so that the chip contact pads having the solder solution appliedthereto can face a surface of the lens substrate 418 having contact pads414 thereon.

In FIG. 10B, the flipped chip 304 having the chip contact pads withsolder applied is aligned with lens substrate 418. In particular, thechip contact pads, (such as the intersection points of the metal lines402), are aligned with each of the lens contact pads 414. Lens substrate418 is provided having contact pads 414 located thereon. Although lenscontact pads 414 are presented as metal squares, it should beappreciated that the lens contact pads can be in the form of metallines.

In FIG. 10C, the chip 304 is lowered onto the lens substrate 418 and thechip is bonded to the lens substrate via the solder solution in responseto the application of pressure and/or heat. In an aspect, heat isapplied at a temperature less than 200° C. to substantially only thearea of the substrate 418 where the chip 304 is being assembled (e.g.the assembly sites) so as to cause no or limited damage to the remainingarea of the substrate. For example, a flip chip bonder can perform theflipping, aligning and bonding aspects of method 900. In an aspect, anunderfill material (not shown) can be applied between the lens substrate418 and the chip 304 so as to fill in gaps between the solidified soldermaterial and further adhere the chip 304 to the substrate 418. In FIG.10D, once the solder solution has been solidified, hardened and/orcured, in an aspect, the chip 304 can be sealed onto the lens substrate418 using a sealant 504. The sealant 504 can cover and/or otherwise coatthe chip 304 to hold the chip 304 in place on the lens substrate 418and/or to make the lens substrate/chip complex biocompatible. In anaspect, (not shown), the entire substrate/chip complex can be coated ina sealant 504. For example, the entire substrate/chip complex can bedipped or rinsed with a sealant 504.

Referring now to FIGS. 11A-11C, illustrated is a process for employing acontact lens substrate having a silicon chip bonded thereon to form acontact lens in accordance with aspects described herein. As seen inFIG. 11A, a contact lens substrate 1102 having a silicon chip 1104bonded thereon is provided. In various aspects, the contact lenssubstrate 1102 and chip 1104 can include one or more of the structureand/or functionality of contact lens substrate layer 214 and chip 206,and/or the contact lens substrate 418 and chip 304 (and vice versa). Inan aspect, the chip 1104 is sealed to the contact lens substrate 1102via a sealant (e.g. parylene).

The contact lens substrate 1102 is used to form a contact lens form1112. In an aspect, the contact lens substrate 1102 is molded into ashape of a contact lens form 1112. (e.g. a round and curved shape). Inparticular, the contact lens substrate 1102 is molded to match thecurvature of an eye in which the contact lens is to be worn. In someaspects, in order to facilitate molding the contact lens substrate 1102,the contact lens substrate 1102 is cut into a shape that can be formedinto the shape of a contact lens. For example, as seen in FIG. 11B, thecontact lens substrate 1102 can be cut into a circular shape or ringshape 1110. The cut substrate 1110 shown in FIG. 11B is cut out of thecontact lens substrate 1102 along dotted line pattern 1106. The cutsubstrate 1110 can include cut slits or incisions 1108 on inner and/orouter edges of the ring to facilitate forming the cut substrate 1110into a contact lens shape. The cut substrate 1110 is cut out of thecontact lens substrate 1102 so as to include the attached chip 1104.

FIG. 11C shows a two-dimensional view of a contact lens form 1112 formedout of contact lens substrate 1102. Contact lens form 1112 includes chip1104. In an aspect, contact lens form 1112 is formed by closing off theincisions 1108 of cut substrate 1110. For example, the open edges of cutsubstrate 1110 can be bended and brought together (e.g. following thedashed arrow of FIG. 11B) to form the contact lens form 1112 of FIG.11C.

FIG. 12A presents an alternative, three-dimensional view of contact lensform 1112. In an aspect, contact lens form 1112 can be employed as afinished, wearable/functional contact lens. Contact lens form matchesthe shape of a contact lens and forms to the curvature of the eye inwhich it is to be worn. Contact lens form further includes the chip 1104integrated thereon. However, in another aspect, contact lens form isfurther processed to form a finished, wearable/functional contact lens.

FIG. 12B depicts the final processing of contact lens form 1112 to forma contact lens 1202. Contact lens 1202 comprises the contact lens 1112form embedded and/or coated on one or more sides with contact lensmaterial 1204. In various aspects, the contact lens material 1204 caninclude one or more of the structure and/or functionality of lensmaterial 216 (and vice versa). For example, in an aspect, the contactlens material 1204 is hydrogel, such as silicone hydrogel. Contact lens1202 can also include one or more of the structure and/or functionalitycontact lenses 100, 200, 202, 204 (and vice versa). For example, contactlens 1202 can include contact lens form 1112 entirely embedded incontact lens material 1204 and/or partially covered with contact lensmaterial 1204. In an aspect, in order to form contact lens 1202, contactlens form 1102 is dipped into a liquid contact lens material and thenthe contact lens material is allowed to solidify.

FIGS. 13-15 illustrates methodologies or flow diagrams in accordancewith certain aspects of this disclosure. While, for purposes ofsimplicity of explanation, the methodologies are shown and described asa series of acts, the disclosed subject matter is not limited by theorder of acts, as some acts may occur in different orders and/orconcurrently with other acts from that shown and described herein. Forexample, those skilled in the art will understand and appreciate that amethodology can alternatively be represented as a series of interrelatedstates or events, such as in a state diagram. Moreover, not allillustrated acts may be required to implement a methodology inaccordance with the disclosed subject matter. Additionally, it is to beappreciated that the methodologies disclosed in this disclosure arecapable of being stored on an article of manufacture to facilitatetransporting and transferring such methodologies to computers or othercomputing devices.

Referring now to FIG. 13, presented is a flow diagram of an exampleapplication of systems and apparatuses disclosed in this description inaccordance with an embodiment. In an aspect, in exemplary methodology1300, a contact lens is formed having a silicon chip integrated therein.At 1310, a plurality of chip contact pads are formed on a chip byforming a plurality of metal lines on a surface of the chip. (e.g. usingphotolithography). At 1320, solder solution is applied to each of aplurality of lens contact pads formed on a lens substrate (e.g. using asyringe). At 1330, the plurality of chip contact pads are bonded to theplurality of lens contact pads via the solder solution to bond the chipto the lens substrate (e.g. using a flip chip bonder). Then at 1340, thelens substrate is embedded into a hydrogel to form a contact lens.

Referring now to FIG. 14, presented is a flow diagram of another exampleapplication of systems and apparatuses disclosed in this description inaccordance with an embodiment. In an aspect, in exemplary methodology1400, a contact lens is formed having a silicon chip integrated therein.At 1410, a plurality of chip contact pads are formed on a chip byforming a plurality of metal lines on a surface of the chip. (e.g. usingphotolithography). At 1420, solder solution is applied to each of aplurality of lens contact pads formed on a lens substrate (e.g. using asyringe). At 1430, the plurality of chip contact pads are bonded to theplurality of lens contact pads via the solder solution to bond the chipto the lens substrate (e.g. using a flip chip bonder). At 1450, the lenssubstrate is sealed onto the chip (e.g. using a sealant 1504). At 1460,the lens substrate is cut into a ring shape and molded to match thecurvature of an eye over which a contact lens is to be worn. Then at1340, the lens substrate is embedded into a hydrogel to form the contactlens.

Referring now to FIG. 15, presented is a flow diagram of an exampleapplication of systems and apparatuses disclosed in this description inaccordance with an embodiment. In an aspect, in exemplary methodology1500, a contact lens is formed having a silicon chip integrated therein.At 1510, a plurality of chip contact pads are formed on a chip byforming a plurality of metal lines on a surface of the chip. (e.g. usingphotolithography). At 1520, solder solution is applied to each of theplurality of chip contact pads (e.g. using a syringe). At 1530, theplurality of chip contact pads are bonded to a plurality of lens contactpads via the solder solution to bond the chip to the lens substrate(e.g. using a flip chip bonder). Then at 1540, the lens substrate isembedded into a hydrogel to form a contact lens.

What is claimed is:
 1. A method for manufacturing a contact lens havingan integrated circuit, comprising: creating a plurality of chip contactpads on a chip by forming a plurality of metal lines on a surface of thechip; applying assembly bonding material to each of a plurality of lenscontact pads formed on a lens substrate; bonding the plurality of chipcontact pads to the plurality of lens contact pads via the assemblybonding material to bond the chip to the lens substrate; and embeddingthe lens substrate and the chip bonded thereon into a contact lensmaterial to form the contact lens.
 2. The method of claim 1, wherein theforming the plurality of metal comprises forming the plurality of metallines using photolithography.
 3. The method of claim 1, furthercomprising, prior to the embedding, sealing the chip on the lenssubstrate.
 4. The method of claim 1, further comprising, prior to theembedding, cutting the lens substrate into a ring shape and molding thelens substrate to match a curvature of an eye over which the contactlens is to be worn.
 5. The method of claim 1, wherein the chip has athickness of about 100 microns or less and a length of about 1.0millimeter or less.
 6. The method of claim 1, wherein the contact lensmaterial includes at least one of a hydrogel, a silicone hydrogel or asilicone elastomer.
 7. The method of claim 1, wherein the bonding isperformed employing a flip-chip bonder.
 8. A contact lens having anintegrated circuit disposed thereon or therein formed by a processcomprising the steps of: creating a plurality of chip contact pads on achip by forming a plurality of metal lines on a surface of the chip;applying assembly bonding material to each of the plurality of chipcontact pads; bonding the plurality of the chip contact pads to aplurality of lens contact pads formed on a lens substrate via theassembly bonding material to bond the chip to the lens substrate; andembedding the lens substrate having the chip bonded thereon into acontact lens material to form the contact lens.
 9. The contact lens ofclaim 8, wherein the step of forming the plurality of metal linescomprises forming the plurality of metal lines using photolithography.10. The contact lens of claim 8, wherein the process further comprisesthe step of, prior to the embedding, sealing the chip on the lenssubstrate.
 11. The contact lens of claim 8, wherein the process furthercomprises the step of, prior to the embedding, cutting the lenssubstrate into a ring shape and molding the lens substrate to match acurvature of an eye over which the contact lens is to be worn.
 12. Thecontact lens of claim 8, wherein the chip has a thickness of about 100microns or less and a length of about 1.0 millimeter or less.
 13. Thecontact lens of claim 8, wherein the bonding is performed employing aflip-chip bonder.
 14. The contact lens of claim 8, wherein the contactlens material includes at least one of a hydrogel, a silicone hydrogelor a silicone elastomer.
 15. A method for manufacturing a contact lenshaving an integrated circuit, comprising: creating a plurality of lenscontact pads on a lens substrate; creating a plurality of chip contactpads on a chip; applying assembly bonding material to the each of theplurality of lens contact pads or chip contact pads; aligning theplurality of lens contact pads with the plurality of chip contact pads;bonding the chip to the lens substrate via the assembly bonding materialusing flip chip bonding; and forming a contact lens with the lenssubstrate.
 16. The method of claim 15, wherein the creating theplurality of the lens contact pads comprises forming a plurality ofmetal lines on the lens substrate using photolithography.
 17. The methodof claim 15, wherein the creating the plurality of the lens contact padscomprises forming a plurality of metal squares having a length of about100 microns or less.
 18. The method of claim 15, wherein the creatingthe plurality of the chip contact pads comprises forming a plurality ofmetal lines on the chip using photolithography.
 19. The method of claim15, wherein the forming the contact lens comprises: sealing the chip onthe lens substrate; cutting the lens substrate into a ring shape andmolding the lens substrate to match a curvature of an eye over which thecontact lens is to be worn; and embedding the lens substrate into ahydrogel.
 20. The method of claim 15, wherein the chip has a thicknessof about 100 microns or less and a length of about 1.0 millimeter orless.
 21. The method of claim 15, wherein the bonding the chip to thelens substrate via the assembly bonding material comprises employingpressure and heat at a temperature of 200° C. or less.
 22. A contactlens comprising: a substrate; and a silicon chip embedded within thesubstrate, the silicon chip having a thickness of about 100 microns orless and a length of about 1.0 millimeter or less.
 23. The contact lensof claim 22, wherein the silicon chip has a thickness of about 50microns or less and a length of about 1.0 millimeter or less.
 24. Thecontact lens of claim 22, wherein the substrate comprises at least oneof a hydrogel, a silicone hydrogel or a silicone elastomer.
 25. Thecontact lens of claim 22, wherein the chip is bonded to a polymermaterial embedded within the substrate and the chip is sealed on thepolymer material with parylene.